2023/08/23 21:38:34 | |
---|---|
Price | |
17.2402 USD | |
Difference | 0.00% (0.00) |
ISIN | TW0002330008 |
Symbol | - |
Exchange | FINRA other OTC Issues |
Currency | USD |
Sector | Technology |
Security type | Stock |
Market cap (m) | 691,917 EUR |
Benchmark | DOW JONES TITANS ASIAN 50(USD) |
Bid (Bid size) | - |
Ask (Ask size) | - |
Open | 17.2402 USD |
High | 17.2402 USD |
Low | 17.2402 USD |
Close (prev. day) | 17.2402 USD |
VWAP | 22.223279 USD |
Volume (pcs) | 8,022,000 |
Trading volume | 138,300,972.64 |
Number of trades | 6 |
Last size | 511,000 |
Related Futures | - |
Related Options | - |
Date | Headline | Download | |
2024/08/12 |
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Global Equity Ratings |
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2024/07/24 |
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Global Equity Ratings |
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2024/07/12 |
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Global Equity Ratings |
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2024/06/21 |
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Global Equity Ratings |
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2024/06/14 |
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Global Equity Ratings |
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2023/08/23 21:38:34 | |
---|---|
Price | |
17.2402 USD | |
Difference | 0.00% (0.00) |
ISIN | TW0002330008 |
Symbol | - |
Exchange | FINRA other OTC Issues |
Currency | USD |
Sector | Technology |
Security type | Stock |
Market cap (m) | 691,917 EUR |
Benchmark | DOW JONES TITANS ASIAN 50(USD) |
Bid (Bid size) | - |
Ask (Ask size) | - |
Open | 17.2402 USD |
High | 17.2402 USD |
Low | 17.2402 USD |
Close (prev. day) | 17.2402 USD |
VWAP | 22.223279 USD |
Volume (pcs) | 8,022,000 |
Trading volume | 138,300,972.64 |
Number of trades | 6 |
Last size | 511,000 |
6m | 1Y | 3Y | |
Perf (%) | - | - | - |
Perf (abs.) | - | - | - |
Beta | 2.44 | 2.33 | 1.72 |
Volatility | - | - | - |
Ø price 5 days | Ø volume 5 days (pcs.) | - USD (-) |
Ø price 30 days | Ø volume 30 days (pcs.) | - USD (199,369) |
Ø price 100 days | Ø volume 100 days (pcs.) | - USD (238,631) |
Ø price 250 days | Ø volume 250 days (pcs.) | - USD (-) |
YTD High | date | - USD (-) |
YTD Low | date | - USD (-) |
52 Weeks High | date | - USD (-) |
52 Weeks Low | date | - USD (-) |
TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD. |
- - |
No. 8, Li-Hsin Rd. 6, Hsinchu Science Park, - 300 Hsin-Chu |
Telefon: +88 6 3 5636688 |
Fax: +88 6 3 5790893 |
E-mail: invest@tsmc.com |
- |
C.C. Wei | Chairman of Managing Board |
Cliff Hou | Member of Executive Committee |
Kevin Zhang | Member of Executive Committee |
Mark Liu | Member of Executive Committee |
Wei-Jen Lo | Member of Executive Committee |
Y.J. Mii | Member of Executive Committee |
J.K. Lin | Member of Executive Committee |
J.K. Wang | Member of Executive Committee |
Lora Ho | Member of Executive Committee |
Rick Cassidy | Member of Executive Committee |
Wendell Huang | Member of Executive Committee |
Y.P. Chin | Member of Executive Committee |
Te Yin Liu | Chairman of Supervisory Board |
Fan Cheng Tseng | Member of Supervisory Board |
Leo Rafael Reif | Member of Supervisory Board |
Ming Hsin Kung | Member of Supervisory Board |
Peter Bonfield | Member of Supervisory Board |
Kuo Tzu Chen | Member of Supervisory Board |
Michael Splinter | Member of Supervisory Board |
Moshe Gavrielov | Member of Supervisory Board |
Ying Chun Hai | Member of Supervisory Board |
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